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Închis RIA HORIZON-JU-CHIPS-2026-3-RIA HORIZON-JU-Chips-2026-3-RIA

Call with Digital Partnership and TTC countries

HORIZON-JU-Chips-2026-3-RIA

Termen limită 16 septembrie 2026 Termen depășit
Data deschiderii 7 iulie 2026
Buget 5 mil. EUR
Granturi estimate 3

Destinație / beneficiari

Horizon Europe

1. Descriere

Rezultate așteptate

The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes:

• Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications.

• Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint.

• Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration.

2. Informații de suport

For any questions related to this call please contact : Calls@chips-ju.europa.eu

Online Manual is your guide on the procedures from proposal submission to managing your grant.

Horizon Europe Programme Guide contains the detailed guidance to the structure, budget and political priorities of Horizon Europe.

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3. Priorități
  • DigitalAgenda